V-01
AIthon + I-Edge
Connect AI model training in development with model deployment, execution and management in production for industrial visual inspection.
View detailsSOLUTIONS / INSPECTION
Machine vision and AI inspection
From AI model training and deployment to semiconductor wire-bond inspection, high-mix visual inspection and printed-document quality inspection.
PRODUCTS & SYSTEMS
Products and systems in this family
Explore functions, structure and applications by product.
V-02
Semivue
Combine AOI and AI for 2D and 3D visual inspection of frames, ICs, components, wires and bond points in semiconductor wire bonding.
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V-03
Integrated AI vision inspection system
Use a six-axis robot, optical modules and vision algorithms to inspect PCBs and enclosures while retaining inspection images and results.
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V-04
Vehicle document print-quality inspection system
Combine OCR, format validation, seal and label recognition, and print-defect inspection to compare vehicle documents with business-system data.
View detailsINSPECTION / PROJECTS
Inspection projects and validation
Explore inspection methods and validation paths across factory inspection, assembly inspection, AOI re-inspection and wire-bond measurement.
M-01Case study
Factory-wide AI inspection for engine production
Brings distributed checks across casting, machining and assembly into one monitoring platform.
M-02Case study
AI monitoring of engine assembly sequence
Monitors critical steps and sends exception signals to shop-floor controls.
M-03Case study
Automatic tailgate appearance inspection
Checks assembly consistency under changing lighting and vehicle-position variation.
V-103D profile and metrology
3D wear inspection for shafts and racks
Uses 3D profiles and point clouds to evaluate post-test wear and structure.
V-01AOI review / resin parts
Reducing AOI false positives with AI review: a resin-board POC
A second AI decision layer analyses crease and dent candidates after AOI, using manual review as the reference for this POC.
V-09High-speed continuous-material inspection
In-process delamination detection for high-speed web materials
Line-scan imaging, anomaly detection, UI alerts, stack lights and buzzers, and equipment interlocks provide an in-process inspection approach for continuous web materials.
V-15Semiconductor wire-bond inspection
A small-sample AOI + AI POC for wire-bond appearance defects
AOI geometry and position checks share one workflow with AI recognition of complex defects, testing feasibility with a very small initial sample set.
V-16Wire-bond 2D geometry measurement
A four-field 2D repeatability demo for wire-bond geometry
Multiple lighting conditions and repeated measurements examine the stability of centre, diameter and width for first, second and heavy-wire bonds.
V-17Wire-bond 3D path and height inspection
Reconstructing wire-bond paths and loop height with focus stacking
Z-stack imaging reconstructs the wire path and measures bond geometry, wire curvature, and relative loop height in a 3D inspection demo.
NEXT STEP
Discuss your challengeStart by defining the operational challenge.
Share the current process, constraints and intended outcome. We will assess the smallest verifiable starting scope.