V-02 / INSPECTION
Semivue
Combine AOI and AI for 2D and 3D visual inspection of frames, ICs, components, wires and bond points in semiconductor wire bonding.
Back to family catalogue←Objects and defect types
Visible-light inspection covers frames, components, copper, aluminium and gold wires, and bonds, including foreign objects, cracks, insufficient silver paste, bent, shorted, broken or crossed wires, and bond-position or shape anomalies.
Inspection objects and defect modes
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| Category / inspection area | Defect modes inspected |
|---|---|
| IC | Cracks, splits, foreign objects and placement offsets |
| Capacitors | Cracks, foreign objects and placement offsets |
| Silver plating | Uneven silver plating |
| Frame | Foreign objects |
| Wire bonding / wires | Bent wires, wire shorts, broken wires, crossed wires, wire thickness and indentations |
| Wire bonding / first bond | Presence, positional offset, abnormal shape and foreign objects |
| Wire bonding / second bond | Presence, positional offset, abnormal shape, lift (Y offset) and foreign objects |
Defect analysis and inspection modes
Classify and analyse defects by type, form, area and position. The modular configuration supports 2D and 3D checks in both inline and offline laboratory modes.
2D / 3D technical parameters
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| Parameter | 2D | 3D |
|---|---|---|
| Field of view | 7 mm × 5.6 mm | 9 mm × 5.6 mm |
| Pixel resolution | 2.3μ/Pixel | 5μ/Pixel |
| Working distance | 96 mm | 131 mm |
| Inspection cycle | 2 s/field of view | 5–8 s/field of view |
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