WireBond 2D / 3D inspection system
2D visual and 3D optical inspection for semiconductor packaging, covering ICs, capacitors, silver plating, lead frames, wires and bonds.
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Product GENSTAR / 3D
Manual 3D WireBond Inspection System
Manually load and position samples, then use microscope focus-based measurement to inspect WireBond loop height, bond geometry and position.
PRODUCT OVERVIEW
Product overview
- Applications
- Semiconductor bonding
- Technology
- 3D optical inspection
Inspection objects
- Precision wire bonds
- Small bonds
01 / INSPECTION
Inspection & measurement
- Manual loading and sample positioning
- Loop shape and height
- Bond geometry and thickness
02 / METHOD
Inspection method
After an operator loads and positions the sample, a microscope and high-resolution camera acquire focal-plane images to analyze 3D bond geometry.
Confirm the configuration and inspection scope for the sample, field of view and production requirements.
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