01
Bump diameter
Measure projected contours and 2D diameter to assess dimensional consistency.
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ProductMICROBUMP / 3D METROLOGY
MicroBump3D inspection & metrology
Measure microbump diameter, height and 3D shape with multiple projections and shadow-profile metrology to assess geometric consistency before bonding.
- Minimum measurable bump
- 10μm φ
- Pixel resolution
- 0.35μm / Pixel
- Diameter · height · shape
- 3D
INSPECTION FOCUS
From individual bumps to array geometry.
Assess dimensional consistency at the bonding interface through bump diameter, height and shape.
02
Bump height
Analyze bump height from multiple projections to assess height consistency across the array.
03
3D shape
Measure pillar, conical and pyramidal forms, with imaging conditions selected for the actual bump geometry.
IMAGING & ANALYSIS
Multiple projections. Fine geometry.
Shadow-profile metrology extracts boundaries from spatial projections and analyzes 3D geometry. Three TDI line-scan cameras work with blue semiconductor-laser illumination and a scanning stage for array measurement.
Discuss samples and imaging
- 01Multi-view imaging→
- 02Contour extraction→
- 033D geometry analysis→
- 04Measurement output
TECHNICAL SPECIFICATIONS
Specifications & conditions
| Item | Specification |
|---|---|
| Wafer sizes | 6 / 8 / 12 inchSelect the configuration by wafer size |
| Minimum measurable bump | 10 μm φ |
| Camera configuration | 8192 Pixel TDI × 3 |
| Pixel resolution | 0.35 μm / Pixel |
| Measurement repeatability (σ) | ±0.1 μm / ±0.2 μmFor 2D diameter and 3D height respectively; not absolute measurement accuracy |
| Inspection time | 12 min / 6 inchFor a 6-inch wafer with 2 million bumps; varies with bump size, magnification and scanning conditions |
Pixel resolution, repeatability and absolute accuracy are distinct metrics. Confirm equipment configuration, inspection time and acceptance conditions with actual samples.
MORPHOLOGY & ARRAY OBSERVATION
Fine morphology & array observation
Pointed-bump morphology
Observe the array and local morphology of pointed bumps, focusing on tip contours, spacing and shape consistency.
Bump-array morphology
View the arrangement and contours of pillar bumps to understand the objects used in array localization and 3D geometric analysis.
SAMPLE EVALUATION
Start with samples. Define the configuration.
Provide actual samples
Describe the package, bump or wire geometry and the inspection questions.
Define inspection and acceptance
Specify regions, measurements or defect classes and decision conditions.
Confirm the configuration
Review imaging, handling, cycle time and output for an assessable system proposal.
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