GENSTAR / INSPECTION & INTELLIGENCE
We combine optical inspection, X-ray imaging and vision AI for precision inspection. Industrial language models make manufacturing data easier to query, analyze and apply.
OUR BUSINESS
Support quality and efficiency in manufacturing through precision inspection, industrial vision and intelligent sensing, and industrial LLM applications.
INSPECTION
Build inspection systems with optical 2D / 3D and X-ray equipment, imaging, measurement and automation integration.
Explore inspection equipmentINDUSTRIAL VISION
Apply vision AI to object detection, state recognition and anomaly analysis for quality inspection, assembly checks and workplace safety monitoring in manufacturing.
Explore solutionsINDUSTRIAL LLM
Connect enterprise data and language models for natural-language queries, intelligent reporting and analysis across production, quality and business management.
Explore SmartInsightINDUSTRIES & APPLICATIONS
Address quality challenges across manufacturing, from packaging processes to precision components.
Inspect wire, bond and bump defects for bonding and packaging quality, and observe internal package structures after molding.
Explore solutionsInspect component appearance, assembly position and solder quality on PCBs and electronic assemblies. Observe internal structures to support analysis and review of complex defects.
Explore PCB inspectionInspect surface defects, foreign material, contacts and geometric profiles in electronic connectors and other precision components, focusing on quality differences in fine structures.
Explore solutionsExamine wear, profile changes and structural anomalies in steering shafts and racks after durability or impact tests to support test analysis.
Explore solutionsPRODUCTS & SOLUTIONS
FEATURED PRODUCT
Combine 2D visual inspection and 3D geometry measurement for semiconductor wires and bonds. Inspect wire bends, shorts and breaks, as well as bond position, shape and foreign material.
INSPECTION APPLICATIONS
WireBond · Vision AI
Classify bond shapes from inspection images with vision AI, using contour and shape features to support appearance assessment.
WireBond · 2D metrology
Locate bond centers and measure ball diameter and bond width. Compare repeated acquisitions to examine measurement consistency.
WireBond · Optical 3D
Reconstruct wire trajectories from images at different focal planes and extract relative loop height to reveal the wire geometry in space.
MicroBump · Morphology
Examine tip contours, array arrangement and local shapes to compare bump morphology and identify the structures for 3D measurement.
MicroBump · 3D metrology
Measure microbump diameter, height and 3D shape with multiple projections and shadow-profile metrology to assess array geometry consistency.
WireBond · X-ray inspection
Use X-ray imaging and image processing to trace wire paths, inspect wire shape and arrangement, and observe structures inside semiconductor packages.
ABOUT GENSTAR
We actively expand into overseas markets and serve Japanese manufacturers.
GENSTAR brings together optical design, inspection equipment, AI algorithms and quality analytics. We focus on semiconductors and advanced packaging, with applications in precision manufacturing and automotive components. Teams in Hangzhou, Tianjin, Hamamatsu, Tokyo and Kyoto collaborate on development and engineering, from sample evaluation to system integration.
Discover GENSTARLET'S CONNECT
Get in touch for an initial enquiry, a technical conversation or a discussion of possible solutions.
