Microbump 3D metrology
Measure microbump diameter, height and 3D shape.
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Product GENSTAR / 3D
Bump Manual Solder-Bump Inspection System
A manual solder-bump inspection system for package and flip-chip substrates, measuring coplanarity and inspecting tip profiles and attached foreign material.
PRODUCT OVERVIEW
Product overview
- Applications
- Semiconductor bonding
- Technology
- 3D optical inspection
Inspection objects
- Solder bumps on package substrates
- Flip-chip substrates
- Bump-array coplanarity and tip appearance
01 / INSPECTION
Inspection & measurement
- Solder-bump coplanarity measurement
- Bump-tip cross-sectional profile observation
- Inspection of attached material at bump tips
02 / METHOD
Inspection method
Use the Shadow Figure method to assess solder-bump coplanarity and tip profiles, with local profile observation for attached foreign material.
Substrate size can be adapted. Confirm inspection scope and measurement conditions for bump shape, pitch and samples; the stated cycle applies to the high-speed type.
TECHNICAL SPECIFICATIONS
Technical specifications
| Item | Specification |
|---|---|
| Substrate size | ≤ 45 × 45 mmSize can be adapted |
| Resolution | 6 μmConfirm the resolution definition for the configuration |
| Measurement repeatability | ± 3 μmRepeat measurement reproducibility |
| Measurement time | ≤ 2 sHigh-speed type |
INSPECTION & MEASUREMENT
Measurement results & observation
Bump coplanarity distribution
View the array measurement distribution to examine substrate bump coplanarity.
Bump-tip profile observation
Observe tip sections and local profiles to inspect attached material.
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