01
Wire shape
Observe internal wire routing, displacement and deformation, defining reference shapes and inspection regions.
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ProductPOST-MOLDING / X-RAY INSPECTION
Post-moldingWireBond inspection
Inspect wires and bond regions concealed by molding with X-ray projections. Build checks around wire shape, continuity and neighboring wires, with feeding, handling and sorting configured for the workpiece.
- Internal package observation
- X-RAY
- Configurable automatic handling
- INLINE
- Wires & bond regions
- WIRE
INSPECTION FOCUS
Bond quality, after encapsulation.
Define checks from package geometry and actual images. Overlap in a 2D projection does not by itself prove physical wire contact.
02
Neighboring wires
Review close wires and projection overlaps, validating viewing directions and decision rules on samples.
03
Wire continuity
Look for unusual interruptions and suspected breaks in wire projections, assessing detectability with actual defect samples.
04
Bond regions
Define observation regions from the die and leadframe layout to review bond positions and nearby internal structures.
IMAGING & ANALYSIS
X-ray imaging & automated inspection
Acquire X-ray projections and organize processing around the actual wire layout. Combine feeding, positioning, imaging and sorting, selecting the configuration for package dimensions, wire materials and line requirements.
- 01Feed & position→
- 02Internal X-ray imaging→
- 03Wire-image assessment→
- 04Sort & output
SYSTEM CONFIGURATION
Configure the system around the workpiece.
Feeding
Tray, magazine, conveyor or parts feeding, selected for the workpiece.
Handling & positioning
Options include conveyor, pick-and-place, XY-stage and index handling.
Imaging
Match the X-ray source and digital detector to package size, materials and observation targets.
Reject processing
Configure marking, sorting, reject discharge or result mapping for the line.
Detectability depends on package materials, wire dimensions, projection direction and imaging conditions. Confirm resolution, cycle time and decision metrics with actual samples and the equipment configuration.
SAMPLE EVALUATION
Start with samples. Define the configuration.
Provide actual samples
Describe the package, bump or wire geometry and the inspection questions.
Define inspection and acceptance
Specify regions, measurements or defect classes and decision conditions.
Confirm the configuration
Review imaging, handling, cycle time and output for an assessable system proposal.
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