WIRE BOND01
Wire-bond appearance
Imaging and judgement for bond, loop, offset and foreign-material defects; current product status is pending.
SEMICONDUCTOR & ELECTRONICS
Vision for micro-defects and precision assembly.
Across wire bonding, connectors and precision electronics, GENSTAR treats imaging, defect definition, sample quality and review as one system.
FIELD STRUCTURE
Capability priorities
CONNECTOR02
Multi-side connector inspection
Multi-station imaging and algorithms for appearance, pins, assembly and dimensions.
TRACEABILITY03
Quality data loop
Connect images, decisions, reviews, lots and process data for continuous improvement.
NEXT STEP
Discuss your challengeBegin by making the field challenge clear.
Share the current process, constraints and intended outcome. We will assess the smallest verifiable starting scope.