SEMICONDUCTOR & ELECTRONICS

Machine vision for micro-defects and precision assembly.

Across wire bonding, connectors and precision electronics, GENSTAR treats imaging, defect definition, sample quality and review as one system.

01CONSTRAINT

02TASK

03SYSTEM

04EVIDENCE

05INPUT

Scenario coverage

Coverage includes wire-bond 2D/3D and AOI+AI, multi-side electronics inspection, and film processes.

FIELD CONSTRAINTS → TASKS → INPUTS

FIELD TASKS

Turn operational constraints into verifiable tasks

Start with on-site constraints, then define task breakdown, capability combinations and implementation validation.

Explore bond, stitch, BSOB and foreign-material recheck in a small-sample POC without generalising.

Measure bond geometry across views while separating truth, calibration and repeat range.

Reconstruct trajectories and heights from focus stacks while clearly defining limitations for long wires, occlusion and absolute-height measurement.

Multi-station appearance and polarising-film states depend on product status and process approval.

PROJECT INPUTS

Describe constraints first; do not upload confidential samples or unapproved field material.

0101

Materials, workpieces, defects or tasks, and the business outcome to improve.

0202

Space, speed, changeover, people, safety and exceptions.

0303

Existing interfaces, processing regions, access controls, retention and operational ownership.

0404

Representative conditions, test isolation, statistical methods and joint sign-off.

NEXT STEP

Share the current process, constraints and intended outcome. We will assess the smallest verifiable starting scope.